Flexible Electronics is a technology that offers huge growth potential. New processing methods provide the promise to realise light, thin, flexible and portable electronics on a large scale. The technology is new, what implies that players often work on one specific aspect in the value chain and that the end customer must set up this value chain by himself.

To bridge that gap, Flexlines wants to develop and coordinate the individual links in the value chain – processes and infrastructure for design and production. The aim of this project is to build a state-of-the-art but stable pilot line and then set up a ‘one-stop-shop’ for the realisation of Flexible Electronics prototypes.

Prototypes that meet the needs of the local industry in the border region will be realised for validation and as showcases.

The project brings together leading partners: TNO (with inputs from Holst Centre / Brightlands Materials Center), imec (research groups in Leuven & Eindhoven, CMST group UGent and IC-Link), TU / e, KU Leuven and DSP Valley

Add visual on BMC’s capabilities wrt adhesion&overmolding and/or modelling

The Lightweight Automotive Program of Brightlands Materials Center focusses on (Hybrid) Thermoplastic Composites in overmoulding and recycling. In this project BMC’s goal is to develop process technology for overmoulding electronic circuits.

For further information, please contact: Ties van Maaren: ties.vanmaaren@brightlandsmc.com

Link to project website: www.flexlines.nl